ADVANCED THERMAL MANAGEMENT STRATEGIES FOR MICROELECTRONICS: ENHANCING HEAT DISSIPATION THROUGH INNOVATIVE COOLING TECHNIQUES
Keywords:
Thermal management, microelectronics, heat dissipation, two-phase cooling, microchannel cooling, thermoelectric cooling, phase change materialAbstract
Background: As microelectronic devices enter the era where they are being packaged down to the nanoscale with greater processing capabilities this question of how to remove high heat levels effectively becomes a key performance and reliability impediment. To satisfy the thermal needs of the next generation electronics, conventional air and passive cooling techniques are no longer adequate. Newer technologies of thermal management such as increasing efficiency by removal of heat have to be explored, although their effectiveness and challenges to installations and in use are still being discussed.
Objective: The purpose of the research is to examine and compare progressive thermal management techniques used in microelectronics concerning their performance and efficiency in heat removal and their feasibility in the restricted and high-powered conditions.
Method: Simulated (experimental) methodology has been used on four realistic cooling solutions, thermoelectric cooling (TEC), microchannel cooling (MCC), phase change materials (PCM), and two-phase cooling (TPC). The different areas of performance measure consisted of junction temperature, thermal resistance, heat transfer coefficient and pressure drop at controlled IP thermal loads.
Results: TPC showed the best efficiency with junction temperature of up to 32.1 o C and heat transfer coefficient of up to 9,800 W/m 2.K and MCC having a balanced performance and moderate energy costs. Though PCM and TEC showed low thermal performance especially at high transient loads, TEC had the highest thermal resistance (0.35 K/W). The pressure drops showed that TPC was more efficient in flowing than MCC.
Conclusion: the two-phase cooling shows the best heat handling ability, whereas MCC is a convenient option between efficiency and scale. Based on these findings it is possible to recommend selective implementation procedures on thermal optimization of micro electronic designs.
